Private Draft

The 29 personas behind AI

We’ve organized every stage and persona in the AI supply chain, informed by real recruiting at frontier companies. Click any row to see matching profiles from our talent graph.

Shaped by Industry Experts
Kumar Chellapilla
Kumar ChellapillaVPE
Jennifer Anderson
Jennifer AndersonVPE / Stanford PhD
Thuan Pham
Thuan PhamCTO
Akash Garg
Akash GargCTO
Linghao Zhang
Linghao ZhangResearch Engineer
Wayne Chang
Wayne ChangEarly FB Engineer
Indrajit Khare
Indrajit KhareEM & Head of Product
← ATOMS & ENERGYUSERS & MARKETS →
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AI Hardware

Designs AI compute silicon
AI Hardware

Known as: ASIC Engineer, Chip Architect, Hardware Engineer, Mechanical Design Engineer, Process Engineer, Reliability Engineer, Test Engineer (Silicon), Packaging Engineer

Designs and builds compute hardware for AI workloads: custom accelerators, chip architectures, silicon, and the manufacturing pipeline from tape-out through volume production. For robotics, includes mechanical design, actuator systems, and electromechanical integration.

Specializations

Chip Architecture & Design ASIC and accelerator design for training and inference workloads. Datapath architecture, memory hierarchy, on-chip interconnects, and the microarchitectural decisions that determine performance, power, and area tradeoffs.
Systems Hardware Board design, server design, interconnects (NVLink, PCIe, CXL), cooling solutions, and power delivery. The physical integration layer between chips and data center infrastructure.
Hardware-Software Co-Design ISA design, memory hierarchy optimization, compiler-hardware interface, and the joint decisions that make hardware programmable and efficient for ML workloads. Works closely with Compilers & Frameworks.
Fabrication, Packaging & Reliability Takes chip designs from tape-out through fabrication, packaging, testing, and into volume production. Owns foundry interface, process node decisions, yield optimization, advanced packaging (CoWoS, chiplets), reliability qualification, failure analysis, and the manufacturing-design feedback loop.
[1]Substrate
Primary

Designs custom silicon, manages fabrication, and owns the manufacturing pipeline from tape-out to production.

[2]Compute
Primary

Chip architecture decisions — datapath, memory hierarchy, interconnects — define AI compute capability.

[3]Intelligence
[4]Systems
[5]Distribution
Jim Harris
Jim Harris
NVIDIA
Chip architect

Picks datapaths, memory hierarchies, interconnect assumptions, and programmability constraints that set the ceiling for training and inference efficiency.

Kenneth Cari
Kenneth Cari
Google
Systems integrator

Turns chips into shippable servers — boards, thermals, power delivery, high-speed links — that survive real rack environments.

Rupert Lee
Rupert Lee
Tesla
Packaging & reliability

Owns yield learning, advanced packaging tradeoffs, failure analysis, and qualification gates that decide what can scale to volume.

Early-Stage
Rare
Growth
Occasional
Enterprise
Primary

Capital-intensive. Chip companies, frontier labs, and well-funded startups only.

Let’s Find Your Next Builder

If you’re hiring at the AI frontier, let’s talk.