We’ve organized every stage and persona in the AI supply chain, informed by real recruiting at frontier companies. Click any row to see matching profiles from our talent graph.







Summary
Known as: ASIC Engineer, Chip Architect, Hardware Engineer, Mechanical Design Engineer, Process Engineer, Reliability Engineer, Test Engineer (Silicon), Packaging Engineer
Designs and builds compute hardware for AI workloads: custom accelerators, chip architectures, silicon, and the manufacturing pipeline from tape-out through volume production. For robotics, includes mechanical design, actuator systems, and electromechanical integration.
Specializations
Where the Work Lives
Designs custom silicon, manages fabrication, and owns the manufacturing pipeline from tape-out to production.
Chip architecture decisions — datapath, memory hierarchy, interconnects — define AI compute capability.
Candidate Archetypes
Picks datapaths, memory hierarchies, interconnect assumptions, and programmability constraints that set the ceiling for training and inference efficiency.
Turns chips into shippable servers — boards, thermals, power delivery, high-speed links — that survive real rack environments.
Owns yield learning, advanced packaging tradeoffs, failure analysis, and qualification gates that decide what can scale to volume.
Company Scale
Capital-intensive. Chip companies, frontier labs, and well-funded startups only.
Featured Roles
If you’re hiring at the AI frontier, let’s talk.